Each machine can be set up with a minimum of effort within a very short time and subsequently allows customers to save costs and time as well as to ensure constant process quality. The ToolScope assistance system has a modular structure, with individual licenses possible for individual applications.
Adaptive Dressing
Enables to monitor and to adapt the dressing cycle suiting to process related wear state of the grinding tool
Material Removal Monitor
Calculation of the actual removed material via machine internal signals and special algorithms.
The extremely low density of the patented core material N-LW delivers significant weight savings. GENIS 2 N-LW tools are lighter and most of all less expensive than comparable tools with a CFRP core. The products can be approved for wheel peripheral speeds of up to 140 m/s.
Through targeted material reduction, the wheel weight has been significantly reduced. The stock removal rate at the core is not random, but is calculated using a computational FEM analysis (Finite Element Method). This means that deformations and potential performance losses can be excluded.
The big challenge is achieving a stable surface quality over the entire lifetime of the tool and thereby minimising the scrap rate. Conventional milling tools can cause problems with chip transport as well as surface flaws in the soft aluminium base alloy. With bimetallic blocks, the problem is further exacerbated by the much harder alloy of the cylinder liner. CENTURIA SM-G tools significantly reduce set-up costs due to the elimination of time-consuming assembly work on the milling tool (cutting inserts). They can also be replated multiple times, making them an economical alternative to conventional milling tools.
With the addition of the MIRA REX VTEC to the product range, we have succeeded in developing technically optimised and adapted honing wheels for use with the VSD dressing system. The MIRA REX VTEC comes in two designs: the VTEC-20 for standard quality and the VTEC-30 for premium quality.
The product assortment for surface grinding of wafers allows to reach highest quality surfaces with a significant improved die strength ratio. The composition of optimized diamond uality, special bond system and an unique core design produced with an innovative production technology at Asahi, guarantees lowest grinding forces during the grinding process.
A new approach to development enables results to be achieved in terms of economic efficiency and "cool" grinding that were previously unheard of. The new specifications cover the flute and relieve grinding on all types of round cutting tools and sets new standards throughout the industry.