Each machine can be set up with a minimum of effort within a very short time and subsequently allows customers to save costs and time as well as to ensure constant process quality. The ToolScope assistance system has a modular structure, with individual licenses possible for individual applications.
Enables to monitor and to adapt the dressing cycle suiting to process related wear state of the grinding tool
Material Removal Monitor
Calculation of the actual removed material via machine internal signals and special algorithms.
The Product Finder helps you to keep track of all our current catalogue articles. Thanks to its intuitive navigation, you will always find the right tool for your application.
The Getting Started function provides extensive knowledge for preparation, assembly and startup of our TYROLIT tools and contains detailed safety instructions for the safe usage of our products.
The extremely low density of the patented core material N-LW delivers significant weight savings. GENIS 2 N-LW tools are lighter and most of all less expensive than comparable tools with a CFRP core. The products can be approved for wheel peripheral speeds of up to 140 m/s.
The extremely low density of the natural fibre core greatly reduces the weight of the grinding wheel compared to other materials. This makes them much easier to handle in production, reduces set-up costs and increases the lifetime of the grinding spindle.
GENIS 2 N-LW tools are produced individually according to customer requirements. The universally usable N-LW technology is ideally suited to wide grinding wheels in centreless applications as well as to small tools in medical technology.
Through targeted material reduction, the wheel weight has been significantly reduced. The stock removal rate at the core is not random, but is calculated using a computational FEM analysis (Finite Element Method). This means that deformations and potential performance losses can be excluded.
Tools determine less wear on spindles and bearings than comparable reference tools. Moreover, significant advantages arise during transport and fitting of the tools. A patent has been applied for with regard to this innovation.
GENIS 2 LW tools can be replated problem-free, therefore the slightly higher purchase price of the core can be compensated quickly. Additonally, LW-cores are significantly cheaper than CF-cores (carbon fiber).
The big challenge is achieving a stable surface quality over the entire lifetime of the tool and thereby minimising the scrap rate. Conventional milling tools can cause problems with chip transport as well as surface flaws in the soft aluminium base alloy. With bimetallic blocks, the problem is further exacerbated by the much harder alloy of the cylinder liner. CENTURIA SM-G tools significantly reduce set-up costs due to the elimination of time-consuming assembly work on the milling tool (cutting inserts). They can also be replated multiple times, making them an economical alternative to conventional milling tools.
The patented design of the grinding tool guarantees a stable process, which significantly reduces scrap due to surface flaws. Internal cooling as well as cooling slots in the grinding layer ensure an optimum grinding result.
Using CENTURIA SM-G tools increases the quality of the end face with respect to microporosity. Smear up the pores optimises the porosity and increases the sealing characteristic of the end face.
With the addition of the MIRA REX VTEC to the product range, we have succeeded in developing technically optimised and adapted honing wheels for use with the VSD dressing system. The MIRA REX VTEC comes in two designs: the VTEC-20 for standard quality and the VTEC-30 for premium quality.
The VTEC technology is tailored to the VSD dressing system and delivers maximum profile retention, an improved dressing cycle and very good reproducible quality on the component.
The product assortment for surface grinding of wafers allows to reach highest quality surfaces with a significant improved die strength ratio. The composition of optimized diamond uality, special bond system and an unique core design produced with an innovative production technology at Asahi, guarantees lowest grinding forces during the grinding process.
The combination of a grit size below 1 μ, optimized diamond quality with specific bond system and a special core design, allows to reach extremely high die strength ratios during the wafer production.
A new approach to development enables results to be achieved in terms of economic efficiency and "cool" grinding that were previously unheard of. The new specifications cover the flute and relieve grinding on all types of round cutting tools and sets new standards throughout the industry.