ELASTIC

Elastic for the watchmaking industry

Elastic-bonded grinding and polishing tools for the machining of precision components. These are mainly used for precision mechanics in the watchmaking, spectacle and jewellery industries. Our ELASTIC grinding tools were adapted for diverse applications and are used in the deburring, effect grinding, fine grinding and polishing of precision components. Show more Show less

  • Adaptable (elastic)
  • Wet and dry grinding
  • Large range of grit sizes
  • Bond versions

Flexible elastic grinding tools with resinoid bond

for finishing implants and tools

Fine grinding, removal and pre-polishing of silicon carbide in resinoid bond. Show more Show less

  • Can be easily adapted to contours
  • Generation of the widest range of surface structures (matting, polishing)

Resin and vitrified bonded grinding tools

for machining stainless steel hip joints

Machining of stainless steel hip joints in wet grinding using honing sleeves. Show more Show less

  • Suitable for various steel alloys.
  • Long lifetime

Silicon carbide grinding tools in self-sharpening resin bonding systems

for the machining of hypodermic needles

Resin-bonded grinding tools for the pointing of hypodermic needles. Show more Show less

  • Burr-free finish
  • Long lifetime
  • Best surface finishes

STARTEC XP-F

Grinding wheels for poloshing shank tools

The STARTEC XP-F product line from TYROLIT provides innovative polishing wheels for the cost-efficient polishing of the functional surfaces of shank tools. These tools feature a new resinoid bond with a high wear resistance combined with tailored micro-diamonds. These new specifications can also be produced in customer-specific shapes and dimensions. They guarantee the best surface finish while at the same time delivering maximum precision for the polished tools. Show more Show less

  • Best surface finish
  • Low wheel wear
  • Highest precision

CENTURIA-E

Backgrinding Wheels for the Semiconductor Industry

The product assortment for backgrinding of wafers allows to reach highest quality surfaces with a significant improved Die Strength Ratio. The composition of optimized diamond quality, special bond system and an unique core design produced with an innovative production technology at Asahi, guarantees lowest grinding forces during the grinding process. In combination with specific process adjustments an outstanding economic efficiency can be reached. Show more Show less

  • Improved Die Strength Ratio
  • Shorter Grinding times
  • Stock range